Geometric Circuits Inc. is a full service printed circuit board supplier. Below is a list of Geometric Circuits PCB manufacturing capabilities.

Geometric Circuits accepts PCB files in Gerber 274X file format and all PCB files should be sent in a zip-format and along with drawings to sales@geometriccircuits.com.

Materials Available:

FR4 (High TG)
Teflon
Rogers
Aluminum Based
Taconic

Production Tolerance

Standard

Advanced

Copper Thickness Min 1/2 oz, Max 6 oz Min 1/3 oz, Max 10 oz
Minimum Outer Line Width .004" .003"
Minimum Inner Line Width .004" .003"
Minimum Outer Space, Trace/Trace .004" .0035"
Minimum Inner Space, Trace/Trace .004" .0035"
Minimum Space, PCB Edge to Conductor .006" .004"
Layer-to-Layer Registration +/- .003" +/- .002"
Maximum Finished PCB Thickness .200" .250"
Minimum Board Thickness Tolerance +/- 10% +/- 6%
Dimensions-Fab O.D. .005" .004"
Fabrication Radius +/- 5 deg +/- 5 deg
Warp Age (inch per inch)(flatness of finished board) 0.75% 0.50%

Pad to Hole Size

Standard

Advanced

Minimum Component Pitch .010" .008"
Minimum Dielectric Thickness .006" .004"
Maximum Number of Layers 16 28
Impedance Control +/- 10% +/- 5%

Pad to Hole Size

Standard

Advanced

Tolerance - Plated Hole Size +/- .003" +/- .002"
Normal Finished Hole Size .010" .008"
Minimum Outer Non-Plated Hole to Trace Spacing .007" .004"
Minimum Inner Non-Plated .007" .004"

Drilling

Standard

Advanced

Minimum Mechanical Drill Size .008" .008"
Minimum Laser Drill Size .004" .004"
Maximum Aspect Ratio 12:01 16:01

Via Fill

Standard

Advanced

Inner Layers Non-Conductive Conductive
Outer Layers Non-Conductive Conductive

Other Attributes

Blind and Buried Via's
Laser Drilled Micro Via's
Entek Organic Coating (OSP)
Via Fill

Surface Finishes Available

Lead HASL
Lead Free HASL
Entek Organic Coating (OSP)
Immersion Ni/Au Minimum Thickness (ENIG)
Immersion Silver
Immersion Tin
Peelable Mask
Carbon Ink
Gold (Ni/Au) Fingers